Rogers RO4835 2-Layer 6.6mil High-Frequency Thin Core PCB with Immersion Gold
1.Introduction of RO4835
Rogers' RO4835 laminate offers enhanced stability at high temperatures and is more resistant to oxidation than other hydrocarbon materials. RO4835 laminates share similar electrical and mechanical properties with RO4350B laminates and are designed for high frequency performance and cost-effective circuit fabrication. It uses standard epoxy/glass (FR-4) processes and is competitively priced.
RO4835 laminates are a low loss material that offer low cost circuit fabrication. These laminates are available with Rogers proprietary LoPro Reverse treated copper foil, ideal for applications requiring low insertion loss.
2.Key Features
RoHS compliant for applications requiring UL 94 V-0
IPC-4103 compliant
Dielectric constant (Dk) of 3.48 +/- .05
Dissipation factor of 0.0037 at 10 GHz
Glass Transition Temp (Tg) >280 °C TMA
Coefficient of Thermal Expansion of 10 ppm/°C on X axis, 12 ppm/°C on Y axis, 31 ppm/°C on Z axis
3.Benefits
Significantly improved oxidation resistance compared to typical thermoset microwave materials
Designed for performance sensitive, high volume applications
Low loss:Excellent electrical performance allows application with higher operating frequencies
Ideal for automotive applications
Tight dielectric constant tolerance:Controlled impedance transmission lines
Lead-free process compatible:No blistering or delamination
Low Z-axis expansion:Reliable plated through holes
Low in-plane expansion coefficient:Remains stable over an entire range of circuit processing temperatures
4.PCB Construction Details
| Specification | Value |
|---|---|
| Base Material | RO4835 |
| Layer Count | 2 layers |
| Board Dimensions | 32.9mm × 60.35mm (±0.15mm) |
| Minimum Trace/Space | 6/6 mils |
| Minimum Hole Size | 0.2mm |
| Blind / Buried Vias | No |
| Finished Board Thickness | 0.24mm |
| Finished Cu Weight | 1 oz (1.4 mils) all layers |
| Via Plating Thickness | 20 µm |
| Surface Finish | Immersion Gold |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Silkscreen on Solder Pads | No |
| Electrical Test | 100% used |
5.PCB Stackup (2-Layer Rigid Structure)
Finished copper – 35 µm
RO4835 dielectric – 6.6 mil (0.168mm)
Finished copper – 35 µm
6.PCB Statistics:
Components:
Total Pads: 28
Thru Hole Pads: 10
Top SMT Pads: 18
Bottom SMT Pads: 0
Vias: 12
Nets: 2
7.Typical Applications
Automotive Radar and Sensors
Point-to-Point Microwave
Power Amplifiers
Phased-Array Radar
RF Components
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
